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devel / comp.arch / The Molybdenum Disulfide route to 3D

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o The Molybdenum Disulfide route to 3DQuadibloc

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The Molybdenum Disulfide route to 3D

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https://news.novabbs.org/devel/article-flat.php?id=32904&group=comp.arch#32904

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Subject: The Molybdenum Disulfide route to 3D
From: jsavard@ecn.ab.ca (Quadibloc)
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 by: Quadibloc - Wed, 21 Jun 2023 00:05 UTC

This article suggests a promising route to 3D chips.

The conventional transistor layer on a silicon chip requires temperatures
above 400 degrees K for fabrication. As a result, depositing more silicon,
polishing, and then growing a second layer of transistors isn't really
viable, as those high temperatures would damage the existing transistors
in the first layer.

https://www.electropages.com/blog/2023/05/mit-researchers-grow-transistors-on-top-chips

outlines how using an alternative material that can be used to make
2-D transistors at lower temperatures could allow 3-D chips to be
fabricated using lithography instead of stacking.

John Savard

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